Invention Grant
- Patent Title: Semiconductor devices and methods for fabricating the same
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Application No.: US16166558Application Date: 2018-10-22
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Publication No.: US10707322B2Publication Date: 2020-07-07
- Inventor: Chih-Yen Chen , Shin-Cheng Lin , Hsin-Chih Lin
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L29/778 ; H01L29/08 ; H01L29/45

Abstract:
A semiconductor device includes a channel layer disposed over a substrate, a barrier layer disposed over the channel layer, a gate electrode disposed over the barrier layer, and a pair of source/drain electrodes disposed on opposite sides of the gate electrode. The pair of source/drain electrodes extend through at least portions of the barrier layer. The semiconductor device also includes a lining layer conformally disposed on bottom portions of the pair of source/drain electrodes.
Public/Granted literature
- US20200127116A1 SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME Public/Granted day:2020-04-23
Information query
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