Invention Grant
- Patent Title: Device, manufacturing method thereof, and electronic device
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Application No.: US16122948Application Date: 2018-09-06
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Publication No.: US10707239B2Publication Date: 2020-07-07
- Inventor: Hidekazu Miyairi , Tomoaki Moriwaka
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@37088a10 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6768cf8b
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786

Abstract:
A wiring having excellent electrical characteristics is provided. A wiring having stable electrical characteristics is provided. A device is manufactured through the steps of forming a first insulating film over a substrate, forming a second insulating film over the first insulating film, removing part of the first insulating film and part of the second insulating film to form a first opening, forming a first conductor in the first opening and over a top surface of the second insulating film, and forming a second conductor by planarizing a surface of the first conductor so as to remove part of the first conductor.
Public/Granted literature
- US20190027501A1 DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE Public/Granted day:2019-01-24
Information query
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