- Patent Title: Thermal interface material having different thicknesses in packages
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Application No.: US16049015Application Date: 2018-07-30
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Publication No.: US10707177B2Publication Date: 2020-07-07
- Inventor: Sung-Hui Huang , Da-Cyuan Yu , Kuan-Yu Huang , Pai Yuan Li , Hsiang-Fan Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/367 ; H01L23/00 ; H01L23/373 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L25/065 ; H01L25/18 ; H01L25/00
Abstract:
A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
Public/Granted literature
- US20180350755A1 Thermal Interface Material Having Different Thicknesses in Packages Public/Granted day:2018-12-06
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