Invention Grant
- Patent Title: Semiconductor structure with etched fin structure
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Application No.: US16231728Application Date: 2018-12-24
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Publication No.: US10707072B2Publication Date: 2020-07-07
- Inventor: Shiang-Bau Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/66 ; H01L29/51 ; H01L29/267 ; H01L29/78 ; H01L29/165

Abstract:
Semiconductor structures are provided. The semiconductor structure includes a substrate and a first fin structure and a second fin structure formed over the substrate. The semiconductor structure further includes an isolation structure formed adjacent to the second fin structure and covering the first fin structure and a gate structure formed over the first fin structure and the second fin structure. In addition, the first fin structure is lower than the second fin structure, and the first fin structure has a curved top surface under the isolation structure.
Public/Granted literature
- US20190131122A1 SEMICONDUCTOR STRUCTURE WITH ETCHED FIN STRUCTURE Public/Granted day:2019-05-02
Information query
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