Invention Grant
- Patent Title: Insulated flat conductive wire having high aspect ratio, method for manufacturing same, and coil
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Application No.: US15937036Application Date: 2018-03-27
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Publication No.: US10706992B2Publication Date: 2020-07-07
- Inventor: Hideaki Sakurai , Koji Hirano
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@70c89b3b
- Main IPC: H01B7/08
- IPC: H01B7/08 ; H01B13/16 ; H01B3/30 ; H01F41/12 ; H01B13/00 ; H01F5/06 ; C25D13/06 ; C09D5/44

Abstract:
This insulated flat conductive wire includes: a flat conductive wire having an aspect ratio a/b of 12 or more, wherein the aspect ratio is a ratio of a length a of a long side of a rectangular cross-section to a length b of a short side thereof; and an insulating film which consists of a polyamide-imide resin or a polyimide resin and coats the flat conductive wire, wherein the insulating film has a film thickness t1 of 10 μm or more at a center portion of the long side of the rectangular cross-section, and the insulating film has a film thickness ratio t1/t2 of 0.80 to 1.35, and wherein the film thickness ratio t1/t2 is a ratio of the film thickness t1 at the center portion of the long side to a film thickness t2 at an edge portion of the long side of the rectangular cross-section.
Public/Granted literature
- US20190066883A1 INSULATED FLAT CONDUCTIVE WIRE HAVING HIGH ASPECT RATIO, METHOD FOR MANUFACTURING SAME, AND COIL Public/Granted day:2019-02-28
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