Invention Grant
- Patent Title: Substance adhesion simulation apparatus
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Application No.: US16249488Application Date: 2019-01-16
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Publication No.: US10706526B2Publication Date: 2020-07-07
- Inventor: Toshiya Takeda
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Karceski IP Law, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2725d53a
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G01N19/04 ; G06K9/00 ; G06T5/00

Abstract:
This substance adhesion simulation system includes an input unit for inputting a model of a device, and information of a presence state of a substance which may be able to adhere to the device, and a processing unit which estimates an adhesion state of the substance to the device by using the information, which is input to the input unit, and the substance is in a liquid state, a gas state, a mist state, a powder state, a dust state, or a state combining the liquid state and the mist state.
Public/Granted literature
- US20190236769A1 SUBSTANCE ADHESION SIMULATION APPARATUS Public/Granted day:2019-08-01
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