Invention Grant
- Patent Title: Negative-working photoresist compositions for laser ablation and use thereof
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Application No.: US15628711Application Date: 2017-06-21
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Publication No.: US10705424B2Publication Date: 2020-07-07
- Inventor: Chunwei Chen , Weihong Liu , Ping-Hung Lu
- Applicant: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.ÀR. L.
- Applicant Address: DE Darmstadt
- Assignee: Merck Patent GmbH
- Current Assignee: Merck Patent GmbH
- Current Assignee Address: DE Darmstadt
- Agent Francis M. Houlihan
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F7/038 ; G03F7/031 ; G03F7/033 ; G03F7/027 ; G03F7/16 ; G03F7/32 ; G03F7/004 ; G03F7/095 ; G03F7/00

Abstract:
A composition crosslinkable by broad band UV radiation, which after cross-linking is capable of cold ablation by a UV Excimer Laser emitting between 222 nm and 308 nm, where the composition is comprised of a negative tone resist developable in aqueous base comprising and is also comprised of a conjugated aryl additive absorbing ultraviolet radiation strongly in a range between from about 220 nm to about 310 nm.The present invention also encompasses a process comprising steps a), b) and c) a) coating the composition of claim 1 on a substrate; b) cross-linking the entire coating by irradiation with broadband UV exposure; c) forming a pattern in the cross-linked coating by cold laser ablating with a UV excimer laser emitting between 222 nm and 308 nm. Finally the present invention also encompasses The present invention also encompasses a process comprising steps a′), b′) c′) and d′) a) coating the composition of claim 1 on a substrate; b) cross-linking part of the coating by irradiation with broadband UV exposure through a mask; c) developing the coating with aqueous base removing the unexposed areas of the film, thereby forming a first pattern; d) forming a second pattern in the first pattern by laser cold laser ablating of the first pattern with a UV excimer laser emitting between 222 nm and 308 nm.
Public/Granted literature
- US20170285475A1 NEGATIVE-WORKING PHOTORESIST COMPOSITIONS FOR LASER ABLATION AND USE THEREOF Public/Granted day:2017-10-05
Information query
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