Invention Grant
- Patent Title: Stress sensor
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Application No.: US15819688Application Date: 2017-11-21
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Publication No.: US10704969B2Publication Date: 2020-07-07
- Inventor: Alfio Zanchi
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Armstrong Teasdale LLP
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01L9/00 ; G01F1/44 ; H01G5/16 ; H01L27/06 ; H01L29/93 ; H01L29/94 ; H03F3/45 ; H03L7/099

Abstract:
A stress sensor is provided, including a substrate and a bridge circuit disposed thereon. The bridge circuit is coupled between an output node and a ground node. The bridge circuit includes a first branch and a second branch, the first having a first resistor, R1, having a first orientation and coupled to a tuning resistor, Rtune, at a first intermediate node. The second branch includes a second resistor, R2, having a second orientation that is different from the first orientation, and coupled to a variable resistor, Rvar, at a second intermediate node. The bridge circuit includes an amplifier having a positive input terminal coupled to the second intermediate node, and a negative input terminal coupled to the first intermediate node. The amplifier generates a voltage output at the output node as a function of mechanical stress applied to the substrate. Rvar is non-linearly tunable based on the voltage output.
Public/Granted literature
- US20190154527A1 STRESS SENSOR Public/Granted day:2019-05-23
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