Invention Grant
- Patent Title: Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
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Application No.: US15738400Application Date: 2016-07-04
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Publication No.: US10703874B2Publication Date: 2020-07-07
- Inventor: Yoichi Takano , Nobuyoshi Ohnishi , Katsuya Tomizawa , Naoki Kashima , Hiroshi Takahashi , Eisuke Shiga
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@35557d2d
- International Application: PCT/JP2016/069739 WO 20160704
- International Announcement: WO2017/006888 WO 20170112
- Main IPC: C08G73/00
- IPC: C08G73/00 ; C08J5/24 ; C08F222/40 ; B32B17/04 ; C09D4/00 ; C09D4/06 ; C08F236/20 ; B32B5/28 ; B32B27/00 ; C08F2/44 ; H05K1/03 ; B32B5/02 ; B32B15/14 ; C08G73/10 ; H01L23/14 ; H01L23/00 ; C08K3/22 ; C08K3/28 ; C08K3/36 ; H01L21/48
Abstract:
The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
Public/Granted literature
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