Invention Grant
- Patent Title: Modeling apparatus and modeling method
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Application No.: US15102607Application Date: 2014-12-15
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Publication No.: US10703085B2Publication Date: 2020-07-07
- Inventor: Hiroyuki Yasukochi
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5d1cbce6
- International Application: PCT/JP2014/006230 WO 20141215
- International Announcement: WO2015/093032 WO 20150625
- Main IPC: B33Y80/00
- IPC: B33Y80/00 ; B33Y50/02 ; B33Y30/00 ; B33Y10/00 ; B29C64/135 ; B29C64/386 ; B29C64/20 ; B29C64/129 ; B29C64/277 ; B29C64/241 ; B29C64/40

Abstract:
A modeling apparatus includes a stage, an irradiation unit, a moving mechanism, and a stage-rotating mechanism. The irradiation unit selectively irradiates a region of a material supplied onto the stage, with an energy ray. The moving mechanism relatively moves, at least in a stacking direction of the material, the stage and the irradiation unit. The stage-rotating mechanism rotates the stage.
Public/Granted literature
- US20160311163A1 MODELING APPARATUS AND MODELING METHOD Public/Granted day:2016-10-27
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