Invention Grant
- Patent Title: Cutting system
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Application No.: US15622706Application Date: 2017-06-14
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Publication No.: US10702957B2Publication Date: 2020-07-07
- Inventor: Yun Liu , Liming Xin , Lvhai Hu , Dandan Zhang , Roberto Francisco-Yi Lu
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation
- Applicant Address: US PA Berwyn CN Shanghai
- Assignee: TE Connectivity Corporation,Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee: TE Connectivity Corporation,Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee Address: US PA Berwyn CN Shanghai
- Agency: Barley Snyder
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5a29f11c
- Main IPC: B23K37/04
- IPC: B23K37/04 ; H01R43/16 ; B25B5/12 ; B25B5/16 ; B23K101/38 ; B23K101/18 ; B23K26/08 ; B23K26/38 ; B23K26/142

Abstract:
A cutting system is disclosed. The cutting system comprises a moving mechanism, a cutter mounted on the moving mechanism, a support table having a material plate disposed thereon, and a fixation device including a pressing plate having a row of teeth defining a row of teeth slots. The row of teeth press the material plate on the support table while the moving mechanism drives the cutter to move along edges of the row of teeth slots. The cutter cuts a plurality of workpieces out of the material plate by a single cutting process.
Public/Granted literature
- US20170274483A1 Cutting System Public/Granted day:2017-09-28
Information query
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