Invention Grant
- Patent Title: Acoustic wave device
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Application No.: US15985949Application Date: 2018-05-22
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Publication No.: US10693440B2Publication Date: 2020-06-23
- Inventor: Satoru Ohkubo , Kazuyuki Imagawa , Ryo Miyamoto
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@72ce40de
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H9/02 ; H03H9/05

Abstract:
An acoustic wave device includes: a first substrate having a first surface on which an acoustic wave element is located; a second substrate having a second surface on which a functional element is located; a third substrate having a third surface, which faces the first and second surfaces, and a fourth surface being opposite to the third surface, a first metal layer separated from the acoustic wave element and a wiring line in the first substrate and connecting the first and third surfaces; a second metal layer separated from the functional element and a wiring line in the second substrate and connecting the second and third surfaces; a first metal pattern located on the third surface, being in contact with the first and second metal layers, and connecting the first and second metal layers; and a terminal located on the fourth surface and electrically connectable to the first metal pattern.
Public/Granted literature
- US20180358951A1 ACOUSTIC WAVE DEVICE Public/Granted day:2018-12-13
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