Invention Grant
- Patent Title: Electrical connector having wafer groups assembled to slots
-
Application No.: US15912898Application Date: 2018-03-06
-
Publication No.: US10693249B2Publication Date: 2020-06-23
- Inventor: Ser Kiat Toh , Paul L. Rishworth , Chien Ching Teh
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agency: Molex, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@c9999fc
- Main IPC: H01R12/73
- IPC: H01R12/73 ; H01R12/70 ; H01R13/6587

Abstract:
The present disclosure discloses an electrical connector which comprises a shell, a first wafer group and a second wafer group. The shell comprises: a first frame portion defining a first slot; a second frame portion defining a second slot; a first supporting portion positioned at a first side of the shell; a second supporting portion positioned at a second side of the shell, and a bridging portion connecting the first frame portion and the second frame portion. The bridging portion, the first frame portion and the second frame portion cooperatively define an air flow channel. The first wafer group is assembled to the first slot. The second wafer group is assembled to the second slot.
Public/Granted literature
- US20180261942A1 ELECTRICAL CONNECTOR Public/Granted day:2018-09-13
Information query
IPC分类: