Invention Grant
- Patent Title: SiC semiconductor device with insulating film and organic insulating layer
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Application No.: US15311459Application Date: 2015-05-15
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Publication No.: US10692978B2Publication Date: 2020-06-23
- Inventor: Katsuhisa Nagao , Hidetoshi Abe
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@69206f89
- International Application: PCT/JP2015/064102 WO 20150515
- International Announcement: WO2015/174531 WO 20151119
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/47 ; H01L29/78 ; H01L29/739 ; H01L29/872 ; H01L23/60 ; H01L29/06 ; H01L23/535 ; H01L29/36 ; H01L29/423 ; H01L29/51 ; H01L23/31

Abstract:
According to the present invention, a semiconductor device includes a first conductivity type SiC layer, an electrode that is selectively formed upon the SiC layer, and an insulator that is formed upon the SiC layer and that extends to a timing region that is set at an end part of the SiC layer. The insulator includes an electrode lower insulating film that is arranged below the electrode, and an organic insulating layer that is arranged so as to cover the electrode lower insulating film. The length (A) of the interval wherein the organic insulating layer contacts the SiC layer is 40 μm or more, and the lateral direction distance (B) along the electrode lower insulating layer between the electrode and SiC layer is 40 μm or more.
Public/Granted literature
- US20170110545A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-04-20
Information query
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