Invention Grant
- Patent Title: Systems and methods for shielded inductive devices
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Application No.: US15965476Application Date: 2018-04-27
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Publication No.: US10692963B2Publication Date: 2020-06-23
- Inventor: Feng Wei Kuo , Chewn-Pu Jou , Huan-Neng Chen , Lan-Chou Cho , Robert Bogdan Staszewski
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01L23/522 ; H01L49/02 ; H03L7/085 ; H03L7/099

Abstract:
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
Public/Granted literature
- US20190237534A1 SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES Public/Granted day:2019-08-01
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