A method for fabricating a semiconductor device includes forming one or more encapsulation spacers each about respective ones of one more memory pillar elements to have a geometry, including forming each encapsulation spacer to have a footing of at least about twice a critical dimension of its corresponding pillar, and depositing dielectric material on the one or more memory pillar elements and the one or more encapsulation spacers to form an interlayer dielectric free of voids based on the geometry.