Invention Grant
- Patent Title: Electronic device package and fabricating method thereof
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Application No.: US16423589Application Date: 2019-05-28
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Publication No.: US10692918B2Publication Date: 2020-06-23
- Inventor: Jin Young Kim , No Sun Park , Yoon Joo Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Ju Hoon Yoon
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1f36ae85
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/00 ; H01L23/498 ; H01L23/528 ; H01L21/56 ; G06K9/00
Abstract:
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
Public/Granted literature
- US20190393258A1 ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF Public/Granted day:2019-12-26
Information query
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