Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
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Application No.: US16341740Application Date: 2018-08-15
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Publication No.: US10692901B2Publication Date: 2020-06-23
- Inventor: En-Tsung Cho
- Applicant: HKC Corporation Limited , Chongqing HKC Optoelectronics Technology Co., ltd.
- Applicant Address: CN Shenzhen CN Chongqing
- Assignee: HKC CORPORATION LIMITED,CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: HKC CORPORATION LIMITED,CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen CN Chongqing
- Agency: WPAT, PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1e6ba45c
- International Application: PCT/CN2018/100590 WO 20180815
- International Announcement: WO2019/042126 WO 20190307
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L29/66 ; H01L21/308

Abstract:
An array substrate and a manufacturing method thereof are provided. The manufacturing method includes steps of: providing a first substrate; providing a first mask and arranging active switches on the first substrate; providing a second mask, forming a photoresist layer on the active switches and sequentially performing following steps of: performing a first wet etching on the active switches, performing a first ashing treatment on the photoresist layer, performing a first dry etching on the active switches, performing a second wet etching on the active switches, performing a second ashing treatment on the photoresist layer and performing a second dry etching on the active switches; providing a third mask and forming a protective layer on a metal layer of the active switches; and providing a fourth mask and forming a pixel electrode layer on the protective layer.
Public/Granted literature
- US20200052009A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-02-13
Information query
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