Invention Grant
- Patent Title: Semiconductor module
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Application No.: US15511512Application Date: 2016-07-15
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Publication No.: US10692810B2Publication Date: 2020-06-23
- Inventor: Kosuke Ikeda , Kenichi Suzuki
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Nutter McClennen & Fish LLP
- International Application: PCT/JP2016/070958 WO 20160715
- International Announcement: WO2018/011969 WO 20180118
- Main IPC: H04B3/00
- IPC: H04B3/00 ; H04B15/00 ; H01L23/522 ; H01L25/07 ; H01L25/18 ; H02M7/00 ; H01L23/538

Abstract:
A semiconductor module includes a first electronic device in which one terminal is connected to a first wiring line, the other terminal is connected to a second wiring line, and a first device current flows in a first current direction from the first wiring line to the second wiring line, and a second electronic device in which one terminal is connected to a third wiring line, the other terminal is connected to a fourth wiring line, and a second device current flows in a second current direction from the third wiring line to the fourth wiring line, the first electronic device and the second electronic device being disposed such that at least part of a first magnetic flux generated by the first device current flowing in the first current direction cancels at least part of a second magnetic flux generated by the second device current.
Public/Granted literature
- US20190088594A1 SEMICONDUCTOR MODULE Public/Granted day:2019-03-21
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