Invention Grant
- Patent Title: Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
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Application No.: US16222403Application Date: 2018-12-17
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Publication No.: US10692797B2Publication Date: 2020-06-23
- Inventor: Karen Bruzda , Kathryn Cancar
- Applicant: Laird Technologies, Inc.
- Applicant Address: US MO Chesterfield
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Chesterfield
- Agency: Harness, Dickey & Pierce, P.L.C.
- Agent Anthony G. Fussner
- Main IPC: C08K3/22
- IPC: C08K3/22 ; H01L23/373 ; C08L83/04 ; C08K3/08 ; C08K3/38 ; C08K3/28 ; H05K7/20 ; C08K3/013 ; H01L23/42 ; C08K3/04 ; C08G77/20 ; C08G77/12
Abstract:
Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.
Public/Granted literature
- US20190122954A1 Thermal Interface Materials With Low Secant Modulus Of Elasticity And High Thermal Conductivity Public/Granted day:2019-04-25
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