An electronic device includes an electronic component, a sealing resin body, and a plurality of conductive members electrically connected to the electronic component in the sealing resin body, including respective portions exposed from the sealing resin body to the outside of the sealing resin body, and having different potentials. The conductive members include a heat sink and a terminal extending from an inside to the outside of the sealing resin body. A surface of the terminal includes, as a part covered with the sealing resin body, a higher adhesion part and a lower adhesion part. The lower adhesion part is provided in an entire portion of a back surface of the terminal, the back surface being opposite to a connection surface of the terminal which is adjacent to a connection part electrically connected to the electronic component. The higher adhesion part is provided in the connection surface.