Invention Grant
- Patent Title: Integrating metal-insulator-metal capacitors with fabrication of vertical field effect transistors
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Application No.: US16396013Application Date: 2019-04-26
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Publication No.: US10692772B2Publication Date: 2020-06-23
- Inventor: Kangguo Cheng , Xuefeng Liu , Heng Wu , Peng Xu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L49/02 ; H01L27/06 ; H01L29/78 ; H01L29/66 ; H01L21/822

Abstract:
Device and methods are provided for fabricating semiconductor devices in which metal-insulator-metal (MIM) capacitor devices are integrally formed with vertical field effect transistor (FET) devices. For example, a semiconductor device includes first and second vertical FET devices, and a capacitor device, formed in different device regions of a substrate. A gate electrode of the first FET device and a first capacitor electrode of the capacitor device are patterned from a same first layer of conductive material. A gate electrode of the second FET device and a second capacitor electrode of the capacitor device are patterned from a same second layer of conductive material. A gate dielectric layer of the second FET device and a capacitor insulator layer of the capacitor device are formed from a same layer of dielectric material.
Public/Granted literature
- US20190259666A1 INTEGRATING METAL-INSULATOR-METAL CAPACITORS WITH FABRICATION OF VERTICAL FIELD EFFECT TRANSISTORS Public/Granted day:2019-08-22
Information query
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