A wafer processing method for forming cut grooves in streets of a wafer provided with a plurality of devices includes a holding step ST1 of holding the back surface side of the wafer by a holding surface of a chuck table, a measurement step ST2 of partitioning the front surface of the wafer held by the chuck table into a plurality of regions and measuring the surface height of the streets in each of the regions, a region-basis height setting step ST3 of setting the lowest surface height in each region as the surface height of the wafer in each region, and a cutting step ST4 of forming cut grooves in the front surface of the wafer while setting, on a region basis, a tip position of a cutting blade, based on the surface height of the wafer set in the region-basis height setting step ST3.