Invention Grant
- Patent Title: Semiconductor device with gate stack
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Application No.: US16126164Application Date: 2018-09-10
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Publication No.: US10692762B2Publication Date: 2020-06-23
- Inventor: Hua-Li Hung , Chih-Lun Lu , Hsu-Yu Huang , Tsung-Fan Yin , Ying-Ting Hsia , Yi-Wei Chiu , Li-Te Hsu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/768 ; H01L23/535 ; H01L29/08 ; H01L29/06 ; H01L29/66 ; H01L23/485

Abstract:
A semiconductor device is provided. The semiconductor device includes a gate stack over a semiconductor substrate and a spacer element over a sidewall of the gate stack. The spacer element has a lower portion and an upper portion, the lower portion has a substantially uniform width. The upper portion becomes wider along a direction from a top of the spacer element towards the lower portion, and a bottom of the upper portion is higher than a top of the gate stack. The semiconductor device also includes a dielectric layer surrounding the gate stack and the spacer element. The semiconductor device further includes a conductive contact penetrating through the dielectric layer and electrically connected to a conductive feature over the semiconductor substrate.
Public/Granted literature
- US20190019727A1 SEMICONDUCTOR DEVICE WITH GATE STACK Public/Granted day:2019-01-17
Information query
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