Invention Grant
- Patent Title: Modular pluggable electronic processing component and distributed processing system formed thereof
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Application No.: US16014389Application Date: 2018-06-21
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Publication No.: US10692676B2Publication Date: 2020-06-23
- Inventor: Franz Hoffmann
- Applicant: MRS Corporate, Inc.
- Applicant Address: US OH Dayton
- Assignee: MRS CORPORATE, INC.
- Current Assignee: MRS CORPORATE, INC.
- Current Assignee Address: US OH Dayton
- Agency: Thomas E. Lees, LLC
- Main IPC: H01H50/14
- IPC: H01H50/14 ; H04L29/08 ; H03K19/17756 ; H04L12/00 ; G06F13/40 ; H01H45/14

Abstract:
A pluggable, modular electronic processing component comprises a housing and programmable circuitry. The housing includes a set of conductive terminals that extend therefrom, and each terminal of the set of conductive terminals is sized and spaced to fit into a corresponding terminal socket of a distribution module. The programmable circuitry contained within the housing comprises a processor and a bus interface communicably coupled to the processor. The bus interface interfaces the pluggable, modular electronic processing component to a bus connected to via the distribution module. Further, the bus interface is coupled to a subset of the conductive terminals of the housing. Moreover, the programmable circuitry comprises a configurable input-output (or a set of configurable I/O) that is coupled to a second subset of the conductive terminals of the housing.
Public/Granted literature
- US20180315569A1 MODULAR PLUGGABLE ELECTRONIC PROCESSING COMPONENT AND DISTRIBUTED PROCESSING SYSTEM FORMED THEREOF Public/Granted day:2018-11-01
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