An optical fingerprint sensing unit includes a substrate, a circuit pattern, an optical fingerprint sensing chip, an encapsulation layer and a fiber-optic layer. The circuit pattern is formed on a surface of the substrate. The optical fingerprint sensing chip is fixed on the substrate. The optical fingerprint sensing chip is electrically connected with the circuit pattern through a metal wire. The optical fingerprint sensing chip, the circuit pattern and the metal wire are covered by the encapsulation layer. The fiber-optic layer is disposed on the encapsulation layer. After a UV-curable optically clear adhesive is subjected to a light-curing reaction, the encapsulation layer is formed.