Invention Grant
- Patent Title: Die interface enabling 2.5D device-level static timing analysis
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Application No.: US16026950Application Date: 2018-07-03
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Publication No.: US10691866B2Publication Date: 2020-06-23
- Inventor: Yifei Dai
- Applicant: Credo Technology Group Limited
- Applicant Address: KY Grand Cayman
- Assignee: Credo Technology Group Limited
- Current Assignee: Credo Technology Group Limited
- Current Assignee Address: KY Grand Cayman
- Agency: Ramey & Schwaller LLP
- Agent Daniel J. Krueger
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5dfeebac
- Main IPC: G06F30/398
- IPC: G06F30/398 ; G06F30/3312 ; G06F30/396 ; G06F111/20 ; G06F119/12

Abstract:
A circuit design verification method suitable for use with a 2.5D transceiver device potentially having hundreds of dice mounted on an interposer. An illustrative method includes: (a) retrieving a design of a circuit that includes multiple integrated circuit dice connected via an interposer, each die having at least one contact for receiving or transmitting a digital signal conveyed by an interchip connection of the interposer, said circuit including an IO cell for each such contact; (b) obtaining a timing model for components of said circuit, the timing model accounting for propagation delays of said IO cells and propagation delays of said interchip connections; (c) performing a static timing analysis of the design using the timing model to determine data required times and data arrival times at each of said components; (d) comparing the data required times with the data arrival times to detect timing violations; and (e) reporting said timing violations.
Public/Granted literature
- US20190050519A1 DIE INTERFACE ENABLING 2.5 D DEVICE-LEVEL STATIC TIMING ANALYSIS Public/Granted day:2019-02-14
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