- Patent Title: Film thickness measuring method and film thickness measuring device
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Application No.: US16030898Application Date: 2018-07-10
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Publication No.: US10690480B2Publication Date: 2020-06-23
- Inventor: Koji Kondo , Naoto Okada , Hirokatsu Aramaki , Katsuya Iwamoto
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota-shi, Aichi-ken
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-shi, Aichi-ken
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@683b6ecc
- Main IPC: G01B11/06
- IPC: G01B11/06 ; B24B37/013

Abstract:
A signal waveform of an estimation signal and a signal waveform of the reflected light intensity signal are coordinated with each other such that a time point when a film thickness is equal to zero in the signal waveform of the estimation signal and a base point in the signal waveform of the reflected light intensity signal coincide with each other. A film thickness corresponding to that estimated value of a signal intensity of a reflected light which corresponds to a film thickness range corresponding to a time range in the signal waveform of the estimation signal and coincides with the signal intensity of the reflected light at a desired time point is set as a film thickness of a thin film at the desired time point.
Public/Granted literature
- US20190017807A1 FILM THICKNESS MEASURING METHOD AND FILM THICKNESS MEASURING DEVICE Public/Granted day:2019-01-17
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