Invention Grant
- Patent Title: Riveting structure and riveting method
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Application No.: US16038222Application Date: 2018-07-18
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Publication No.: US10690161B2Publication Date: 2020-06-23
- Inventor: Yung-Lung Liu , Chung-Nan Lin
- Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED , LITE-ON TECHNOLOGY CORPORATION
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED,LITE-ON TECHNOLOGY CORPORATION
- Current Assignee: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED,LITE-ON TECHNOLOGY CORPORATION
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6b524980
- Main IPC: F16B5/04
- IPC: F16B5/04 ; B21D39/03 ; F16B5/00

Abstract:
A riveting structure and a riveting method are provided. The riveting structure includes a first metal element and a second metal element. The first metal element includes a first upper surface, a pressure-receiving portion and a recess portion. The recess portion is recessed from the first upper surface. The pressure-receiving portion is protruded from a surface of the recess portion. The second metal element includes a second lower surface and a protrusion portion and has a through hole. The protrusion portion is protruded from the second lower surface and correspondingly disposed in the recess portion. The through hole penetrates the second metal element via a central part of the protrusion portion. The pressure-receiving portion is correspondingly received in the through hole and is adapted to be pressed and deformed to be riveted to the through hole.
Public/Granted literature
- US20190316615A1 RIVETING STRUCTURE AND RIVETING METHOD Public/Granted day:2019-10-17
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