Invention Grant
- Patent Title: System and method for bonding structural components
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Application No.: US15884364Application Date: 2018-01-30
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Publication No.: US10688731B2Publication Date: 2020-06-23
- Inventor: Hailing Liu , Rebecca Wan Chai , Lei Wang , Peter Dutton
- Applicant: TE CONNECTIVITY CORPORATION
- Applicant Address: US PA Berwyn
- Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: B29C65/48
- IPC: B29C65/48 ; B29C65/34 ; B29C65/00 ; B29C65/50 ; B29C65/36

Abstract:
System includes a first object having an energy-assisted bonding (EAB) mechanism along a surface of the first object. The EAB mechanism includes a heat-activatable adhesive layer and a carbon-filled (CF) sheet material. The CF sheet material is electrically conductive for resistive heating. A control sub-system is configured to control a coupling actuator to drive an actuator body toward the first object, wherein the actuator body and the first object engage each other. The coupling actuator is configured to apply pressure to the EAB mechanism along the surface of the first object. The control sub-system is also configured to control the power source to apply a current through the CF sheet material of the EAB mechanism to provide thermal energy through resistive heating that activates the adhesive layer along the interface.
Public/Granted literature
- US20190232570A1 SYSTEM AND METHOD FOR BONDING STRUCTURAL COMPONENTS Public/Granted day:2019-08-01
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