Invention Grant
- Patent Title: Cutting apparatus
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Application No.: US15956105Application Date: 2018-04-18
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Publication No.: US10688616B2Publication Date: 2020-06-23
- Inventor: Takahiko Tsuno , Saki Miyakawa , Tomoaki Sugiyama
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4ec09e06
- Main IPC: B23Q17/09
- IPC: B23Q17/09 ; B23Q17/12 ; B26D5/00 ; B24B49/10

Abstract:
A cutting apparatus having a cutting blade for cutting a workpiece held on a chuck table is disclosed. The cutting apparatus includes an elastic wave detecting sensor for detecting an elastic wave due to the rotation of the cutting blade, a reference data storing section configured to store reference data as a set of reference processing elastic wave data and reference idling elastic wave data, a threshold value storing section, a ratio calculating section, and a determining section.
Public/Granted literature
- US20180304429A1 CUTTING APPARATUS Public/Granted day:2018-10-25
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