Invention Grant
- Patent Title: Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder, and flux coated solder
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Application No.: US16304099Application Date: 2017-12-27
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Publication No.: US10688603B2Publication Date: 2020-06-23
- Inventor: Motohiro Onitsuka , Yoko Kurasawa , Toshihisa Kugi , Hiroyoshi Kawasaki
- Applicant: SENJU METAL INDUSTRY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7d4845da
- International Application: PCT/JP2017/046832 WO 20171227
- International Announcement: WO2018/225288 WO 20181213
- Main IPC: B23K35/36
- IPC: B23K35/36 ; B23K35/362 ; B23K35/02 ; B23K35/26 ; B23K35/365 ; B23K35/368 ; B23K35/40
Abstract:
A flux for a resin flux cored solder or a flux coated solder, in which scattering of flux and solder in using the solder is suppressed, and a resin flux cored solder or a flux coated solder including such a flux are provided. The flux for a resin flux cored solder can include a rosin resin, an activator, and at least one selected from an acrylic polymer and a vinyl ether polymer, which has a weight average molecular weight of 8000 to 100000, in an amount of 0.1 to 3 mass-% based on the total mass of the flux.
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