A method of producing an electrical through connection. A cut extending from a first surface to a second surface and separating the area into a first part and a second part is provided on an area of the flexible substrate. At least one of the first and second part is raised from a first plane of the first surface. A first wet conductive layer is printed on the first surface on and around the cut. The first wet layer is solidified into a first dried conductive layer. At least one of the first part and the second part is raised from a second plane of the second surface. A second wet conductive layer is printed on the second surface on and around the cut. The second wet conductive layer is solidified into a second dried conductive layer, which creates an electrical through connection with the first dried conductive layer.