Invention Grant
- Patent Title: Dual-sided FPC assembly and related systems and methods for hotbar soldering FPC assemblies
-
Application No.: US16470045Application Date: 2017-09-20
-
Publication No.: US10687422B2Publication Date: 2020-06-16
- Inventor: Jordan Andrew Kestler , Daniel Thomas Berg , Livius Dimitrie Chebeleu
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- International Application: PCT/US2017/052375 WO 20170920
- International Announcement: WO2018/111367 WO 20180621
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/34

Abstract:
A flexible printed circuit assembly may include a flexible circuit body having a first side and an opposed second side. The circuit body may define first and second soldering areas along the first and second sides of the flexible circuit body, respectively. The first soldering area may include a first set of solder pads and the second soldering area may include a second set of solder pads. The assembly may also include a first stiffening member secured to the second side of the circuit body and a second stiffening member secured to the first side of the circuit body. The first stiffening member may be laterally aligned with the first set of solder pads defined on the first side of the circuit body and the second stiffening member may be laterally aligned with the second set of solder pads defined on the second side of the circuit body.
Public/Granted literature
- US20190357356A1 Dual-Sided FPC Assembly and Related Systems and Methods for Hotbar Soldering FPC Assemblies Public/Granted day:2019-11-21
Information query