Invention Grant
- Patent Title: Headphone
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Application No.: US15637120Application Date: 2017-06-29
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Publication No.: US10687133B2Publication Date: 2020-06-16
- Inventor: Hiromichi Ozawa
- Applicant: Audio-Technica Corporation
- Applicant Address: JP Tokyo
- Assignee: AUDIO-TECHNICA CORPORATION
- Current Assignee: AUDIO-TECHNICA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: W&C IP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@26e10a2c
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033 ; H04R9/02 ; H04R9/06

Abstract:
A headphone is provided that includes a driver unit securely fixed to the baffle plate with a simple structure and has desirable frequency characteristics in a high frequency range and a low frequency range. A headphone includes a baffle plate, a driver unit fixed to the baffle plate, and a fixing member fixing the driver unit to the baffle plate. The fixing member includes a contact part having a shape of a plate in contact with the outer edge of the driver unit.
Public/Granted literature
- US20180103309A1 HEADPHONE Public/Granted day:2018-04-12
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