Invention Grant
- Patent Title: Mounting structure, structural component, and method for manufacturing mounting structure
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Application No.: US16265257Application Date: 2019-02-01
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Publication No.: US10686267B2Publication Date: 2020-06-16
- Inventor: Yurika Otsuka
- Applicant: NEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@c18a72b
- Main IPC: H01R12/62
- IPC: H01R12/62 ; H05K1/14 ; H01R12/72 ; H05K1/02
Abstract:
A mounting structure has a first board, an extended portion which is extended from the end portion of the first board and has a smaller thickness than the first board, and a second board having a connection terminal connected to a connector. The second board is placed on the extended portion.
Public/Granted literature
- US20190245285A1 MOUNTING STRUCTURE, STRUCTURAL COMPONENT, AND METHOD FOR MANUFACTURING MOUNTING STRUCTURE Public/Granted day:2019-08-08
Information query
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