Disclosed is an electrodeposited copper foil, in which a center line roughness average Ra (μm), a maximum height Rmax (μm), and a ten-point height average Rz (μm) of a matte side satisfy an Equation below, 1.5≤(Rmax−Rz)/Ra≤6.5. The electrodeposited copper foil according to the present invention maintains low roughness and high strength, and exhibits a high elongation rate, and particularly, has excellent glossiness, so that the electrodeposited copper foil may be used in a current collector of a medium and large lithigum ion secondary battery and a semiconductor packaging substrate for Tape Automated Bonding (TAB) used in a Tape Carrier Package (TCP).