Invention Grant
- Patent Title: Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
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Application No.: US16356789Application Date: 2019-03-18
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Publication No.: US10686102B2Publication Date: 2020-06-16
- Inventor: Masafumi Kuramoto , Tomohisa Kishimoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/62 ; H01L33/26 ; H01L33/32 ; H01L33/34 ; H01L33/44 ; H01L33/56 ; H01L23/00 ; H01L33/64

Abstract:
The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.
Public/Granted literature
- US20190273188A1 RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS FOR MANUFACTURING THE SAME Public/Granted day:2019-09-05
Information query
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