Wafer bonded solar cells and fabrication methods

Invention Grant

US10686090B2 Wafer bonded solar cells and fabrication methods 有权

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Patent Title: Wafer bonded solar cells and fabrication methods
Application No.: US15705905

Application Date: 2017-09-15
Publication No.: US10686090B2

Publication Date: 2020-06-16
Inventor: Stephen W. Bedell , Cheng-Wei Cheng , Jeehwan Kim , Devendra K. Sadana , Kuen-Ting Shiu , Norma E. Sosa Cortes
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Applicant Address: US NY Armonk
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
Current Assignee Address: US NY Armonk
Agency: Tutunjian & Bitetto, P.C.
Agent Erik Johnson
Main IPC: H01L31/0687
IPC: H01L31/0687 ; H01L31/18

Wafer bonded solar cells and fabrication methods

Abstract:

A photovoltaic device and method for fabrication include multijunction cells, each cell having a material grown independently from the other and including different band gap energies. An interface is disposed between the cells and configured to wafer bond the cells wherein the cells are configured to be adjacent without regard to lattice mismatch.

Public/Granted literature

US20180006180A1 WAFER BONDED SOLAR CELLS AND FABRICATION METHODS Public/Granted day:2018-01-04

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L31/00	对红外辐射、光、较短波长的电磁辐射，或微粒辐射敏感的，并且专门适用于把这样的辐射能转换为电能的，或者专门适用于通过这样的辐射进行电能控制的半导体器件；专门适用于制造或处理这些半导体器件或其部件的方法或设备；其零部件（H01L51/42优先；由形成在一共用衬底内或其上的多个固态组件，而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00）
H01L31/04	.用作光伏〔PV〕转换器件（制造中其测试入H01L21/66；制造之后其测试入H02S50/10）
H01L31/06	..以至少有一个电位跃变势垒或表面势垒为特征的
H01L31/068	...只是PN单质结型势垒的，例如体硅PN单质结太阳能电池或薄膜多晶硅PN单质结太阳能电池
H01L31/0687	....多结或叠层太阳能电池