Invention Grant
- Patent Title: Semiconductor device structure having low Rdson and manufacturing method thereof
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Application No.: US16128952Application Date: 2018-09-12
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Publication No.: US10686071B2Publication Date: 2020-06-16
- Inventor: Jae Hyung Jang , Hee Hwan Ji , Jin Yeong Son
- Applicant: MagnaChip Semiconductor, Ltd.
- Applicant Address: KR Cheongju-si
- Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1a0afdb
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/266 ; H01L29/10 ; H01L27/092 ; H01L21/265

Abstract:
A semiconductor device including a first P-type well region and an asymmetric second P-type well region each formed in a semiconductor substrate; a gate insulating layer and a gate electrode formed on the substrate; a first N-type source/drain region and a second N-type source/drain region that are formed on respective sides of the gate electrode; and an asymmetric LDD region of N-type formed to extend from the second source/drain region, wherein the asymmetric second P-type well region encompasses the second N-type source/drain region and the asymmetric LDD region, and the first N-type source/drain region both the asymmetric second P-type well region and the substrate, and the asymmetric second P-type well region is formed encompassing the second N-type source/drain region and in contact with the first N-type source/drain region.
Public/Granted literature
- US20190027600A1 SEMICONDUCTOR DEVICE STRUCTURE HAVING LOW RDSON AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-01-24
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