Invention Grant
- Patent Title: Gate structure and method of fabricating the same
-
Application No.: US16429616Application Date: 2019-06-03
-
Publication No.: US10686049B2Publication Date: 2020-06-16
- Inventor: Bo-Wen Hsieh , Yi-Chun Lo , Wen-Jia Hsieh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Applicant Address: TW Hsin-chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsin-chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/66 ; H01L29/49 ; H01L21/3213 ; H01L21/28 ; H01L21/027 ; H01L29/51

Abstract:
A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
Public/Granted literature
- US20190288085A1 GATE STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-09-19
Information query
IPC分类: