Invention Grant
- Patent Title: Semiconductor structure, static random access memory and fabrication method thereof
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Application No.: US15811146Application Date: 2017-11-13
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Publication No.: US10685965B2Publication Date: 2020-06-16
- Inventor: Yong Li
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7decf2b9
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/088 ; H01L27/105 ; H01L21/8234 ; H01L29/66 ; H01L27/092 ; H01L29/78 ; H01L29/417 ; H01L29/165 ; H01L29/08 ; G11C11/402

Abstract:
A semiconductor structure, a method for fabricating the semiconductor structure, and a static random access memory are provided. The method includes providing a base substrate including a substrate and a plurality of discrete fins on the substrate. The substrate includes a pass gate transistor region. The method also includes forming a gate structure across a length portion of each fin, covering top and sidewall surfaces of each fin, and on each fin. Further, the method includes forming pass gate doped regions in the fin on both sides of the gate structure in the pass gate transistor region. At least one of the pass gate doped regions is formed by performing an ion-doped non-epitaxial layer process on the fin.
Public/Granted literature
- US20180151572A1 SEMICONDUCTOR STRUCTURE, STATIC RANDOM ACCESS MEMORY AND FABRICATION METHOD THEREOF Public/Granted day:2018-05-31
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