Invention Grant
- Patent Title: Film sensors array and method
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Application No.: US15790057Application Date: 2017-10-23
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Publication No.: US10685944B2Publication Date: 2020-06-16
- Inventor: James Jen-Ho Wang
- Applicant: James Jen-Ho Wang
- Agent Edward James Mischen
- Main IPC: H01L25/16
- IPC: H01L25/16 ; G01K7/01 ; H01L23/46 ; H01L23/32 ; H01L25/00 ; G01K7/22 ; H01L23/13 ; H01L23/00 ; H01L23/14

Abstract:
In accordance with an embodiment, sensor structure has a first, second, and third laminated structures. The second laminated structure is positioned between the first laminated structure and the third laminated structure. The first laminated structure includes a first portion of a first sensing element and the third laminated structure includes a second portion of the first sensing element. The second laminated structure includes spacer elements that can be used to adjust the sensitivity of the sensor structure.
Public/Granted literature
- US20180114784A1 FILM SENSORS ARRAY AND METHOD Public/Granted day:2018-04-26
Information query
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