Invention Grant
- Patent Title: Semicoductor wafer and method of backside probe testing through opening in film frame
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Application No.: US16203570Application Date: 2018-11-28
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Publication No.: US10685891B2Publication Date: 2020-06-16
- Inventor: Michael J. Seddon , Heng Chen Lee
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, Ltd.
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L29/10 ; H01L21/66 ; H01L21/683 ; G01R31/28 ; H01L21/78 ; H01L21/304
Abstract:
A semiconductor test system has a film frame including a tape portion with one or more openings through the tape portion. The opening is disposed in a center region of the tape portion of the film frame. The film frame may have conductive traces formed on or through the tape portion. A thin semiconductor wafer includes a conductive layer formed over a surface of the semiconductor wafer. The semiconductor wafer is mounted over the opening in the tape portion of the film frame. A wafer probe chuck includes a lower surface and raised surface. The film frame is mounted to the wafer probe chuck with the raised surface extending through the opening in the tape portion to contact the conductive layer of the semiconductor wafer. The semiconductor wafer is probe tested through the opening in the tape portion of the film frame.
Public/Granted literature
- US20190096777A1 SEMICODUCTOR WAFER AND METHOD OF BACKSIDE PROBE TESTING THROUGH OPENING IN FILM FRAME Public/Granted day:2019-03-28
Information query
IPC分类:
