Invention Grant
- Patent Title: Substrate treating device and substrate treating method
-
Application No.: US15710095Application Date: 2017-09-20
-
Publication No.: US10685855B2Publication Date: 2020-06-16
- Inventor: Shinji Sugioka
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@31b616fb
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/04 ; H01L21/02 ; H01L21/66 ; H01L21/311

Abstract:
The substrate treating device performs a predetermined treatment on a substrate by immersing the substrate into a treating liquid that contains a predetermined chemical liquid and pure water. Further, the substrate treating device includes a treating tank in which a treating liquid with which a predetermined treatment is performed on the substrate is stored, a supply unit that supplies a chemical liquid or pure water to the treating tank, a discharge unit that discharges the treating liquid stored in the treating tank, and a control unit that controls supply of the treating liquid or the pure water by the supply unit. The control unit causes the supply unit to supply the chemical liquid or the pure water during performing the predetermined treatment.
Public/Granted literature
- US20180090340A1 SUBSTRATE TREATING DEVICE AND SUBSTRATE TREATING METHOD Public/Granted day:2018-03-29
Information query
IPC分类: