• Patent Title: Hybrid-cloth-based method for making TSV substrates
  • Application No.: US15881726
    Application Date: 2018-01-27
  • Publication No.: US10685851B2
    Publication Date: 2020-06-16
  • Inventor: Yuci Shen
  • Applicant: Yuci Shen
  • Main IPC: H01L21/48
  • IPC: H01L21/48 H01L23/498
Hybrid-cloth-based method for making TSV substrates
Abstract:
The disclosure describes a method for making a hybrid cloth integrated column and further making TSV substrates, which comprises the key processing steps: forming a hybrid cloth by using metal wires and supportive wires, which contains at least one 2D array of parallel metal wires in one direction; forming a column of layered structure, which contains at least a plurality of layers of hybrid cloths, wherein all the 2D arrays of parallel metal wires are fixed in the column of layered structure and are arranged into a 3D array of parallel metal wires; making all the layers of the column of layered structure into a solid entity so as to form a hybrid cloth integrated column; and slicing the hybrid cloth integrated column to make TSV substrates.
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