Invention Grant
- Patent Title: Hybrid-cloth-based method for making TSV substrates
-
Application No.: US15881726Application Date: 2018-01-27
-
Publication No.: US10685851B2Publication Date: 2020-06-16
- Inventor: Yuci Shen
- Applicant: Yuci Shen
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498

Abstract:
The disclosure describes a method for making a hybrid cloth integrated column and further making TSV substrates, which comprises the key processing steps: forming a hybrid cloth by using metal wires and supportive wires, which contains at least one 2D array of parallel metal wires in one direction; forming a column of layered structure, which contains at least a plurality of layers of hybrid cloths, wherein all the 2D arrays of parallel metal wires are fixed in the column of layered structure and are arranged into a 3D array of parallel metal wires; making all the layers of the column of layered structure into a solid entity so as to form a hybrid cloth integrated column; and slicing the hybrid cloth integrated column to make TSV substrates.
Public/Granted literature
- US20190237342A1 HYBRID-CLOTH-BASED METHOD FOR MAKING TSV SUBSTRATES Public/Granted day:2019-08-01
Information query
IPC分类: