Invention Grant
- Patent Title: Cu-based sintered bearing and production method for Cu-based sintered bearing
-
Application No.: US15507567Application Date: 2015-09-04
-
Publication No.: US10683566B2Publication Date: 2020-06-16
- Inventor: Yoshinari Ishii , Shinichi Takezoe , Tsuneo Maruyama
- Applicant: Diamet Corporation
- Applicant Address: JP Niigata-shi
- Assignee: Diamet Corporation
- Current Assignee: Diamet Corporation
- Current Assignee Address: JP Niigata-shi
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1e1247f
- International Application: PCT/JP2015/075180 WO 20150904
- International Announcement: WO2016/035880 WO 20160310
- Main IPC: C22C9/06
- IPC: C22C9/06 ; B22F1/00 ; B22F5/00 ; B22F3/02 ; B22F3/10 ; C22C1/04 ; F16C33/14 ; B22F3/16 ; B22F5/10 ; F16C33/12

Abstract:
Provided is a Cu-based sintered bearing comprising: 15-36 mass % of Ni; 3-13 mass % of Sn; 0.05-0.55 mass % of P; and 0.02-4 mass % of C in total, the balance consisting of Cu and inevitable impurities, wherein the content of C forming an alloy with a matrix within Cu—Ni-based main phase grains is 0.02-0.10 mass %.
Public/Granted literature
- US10745780B2 Cu-based sintered bearing and production method for Cu-based sintered bearing Public/Granted day:2020-08-18
Information query