Invention Grant
- Patent Title: Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
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Application No.: US16386925Application Date: 2019-04-17
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Publication No.: US10683440B2Publication Date: 2020-06-16
- Inventor: Yoon Gyung Cho , Kyung Yul Bae , Min Soo Park , Jung Sup Shim , Hyun Jee Yoo
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM LTD.
- Current Assignee: LG CHEM LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@506a7e1f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7cb824ab
- Main IPC: C09J123/22
- IPC: C09J123/22 ; C09J109/00 ; H01L51/00 ; H01L51/56 ; H01L51/52 ; C09J9/00 ; C09J4/00 ; C09J7/20 ; C09J7/10 ; C09J7/00 ; C09J133/08 ; C09J145/00
Abstract:
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Public/Granted literature
Information query
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