Invention Grant
- Patent Title: Leveler, leveler composition and method for electrodeposition of metals in microelectronics
-
Application No.: US16389934Application Date: 2019-04-20
-
Publication No.: US10683275B2Publication Date: 2020-06-16
- Inventor: Yun Zhang , Tao Ma , Peipei Dong , Zifang Zhu , Chen Chen
- Applicant: Shinhao Materials LLC
- Applicant Address: CN Wujiang
- Assignee: SHINHAO MATERIALS LLC
- Current Assignee: SHINHAO MATERIALS LLC
- Current Assignee Address: CN Wujiang
- Agency: SZDC Law P.C.
- Main IPC: C07D311/86
- IPC: C07D311/86 ; C07D311/84 ; C25D3/38 ; C25D7/12 ; C25D3/22 ; C25D3/32 ; C25D3/46 ; C25D3/54
Abstract:
The present application discloses a levelling compound for electrodepositing metals. The metal is of formula (II):
Public/Granted literature
- US20190263773A1 LEVELER, LEVELER COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS Public/Granted day:2019-08-29
Information query
