Invention Grant
- Patent Title: Processing system and device manufacturing method
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Application No.: US16276102Application Date: 2019-02-14
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Publication No.: US10683185B2Publication Date: 2020-06-16
- Inventor: Yoshiaki Kito , Masaki Kato , Kei Nara , Masakazu Hori
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@70c9fba9
- Main IPC: B65H20/34
- IPC: B65H20/34 ; B65H20/02 ; B65H20/24 ; B65H18/10 ; B65H23/188 ; G03F7/16 ; G03F7/24 ; G03F9/00 ; G03F7/30 ; H01L21/677 ; H01L21/67

Abstract:
A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state. A processing system for sequentially conveying a long, flexible sheet substrate along a length direction to each of a first through a third processing device to form a predetermined pattern on the sheet substrate, wherein the first through the third processing devices implement a predetermined process relating to the sheet substrate according to setting conditions set to each processing device, and when at least one from among the states of the actual processing implemented on the sheet substrate by each of the first through the third processing devices exhibits a processing error relative to a target processing state, changes other setting conditions, separate from the setting conditions exhibiting the processing error, according to the processing error.
Public/Granted literature
- US20190177105A1 PROCESSING SYSTEM AND DEVICE MANUFACTURING METHOD Public/Granted day:2019-06-13
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